Diamond Wire Saw for Cutting Silicon Wafer

Diamond wire saw is a flexible cutting tool in which the wire is processed into closed loop and coated with diamond grains on the surface. The wire features small diameter and strong cutting toughness, which makes precision cutting possible, and is an advanced cutting tool at present.

Eigenschaften

  1. Continuous diamond coating on wire surface
  2. Customized grain size
  3. Backing material made of alloyed special steel, stainless steel
  4. High cutting efficiency (speed up to 60m/s)
  5. High cutting precision
  6. Long blade-life
  7. Low electricity consumption
  8. No cooling lubricant

Parameters

Diameter (mm)Grain SizeTensile Strength (N)Loop Length (mm)
0.42200/23080-1001000-10000
0.50170/200, 200/230100-1201000-10000
0.60140/170, 170/200100-1201000-10000
0.65140/170, 170/200100-1201000-10000
0.80120/140, 140/170180-2001000-10000
1.50120/140, 140/170200-3002500-10000
1.80120/140, 140/170200-3002500-10000

 

General Information

VOLDATOOLSTrademark

Product Name: Diamond Wire Saw for Cutting Silicon Wafer

Material: Alloyed special steel, stainless steel

Applications: Graphite, Silicon, Quartz, Glass, Ceramic, etc.

Min Order: 100 pcs

Samples: Free at our cost

Versandart: Seeweg, Luftweg, DHL, UPS, FedEx usw.

Versandhafen: Shanghai, China

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