Diamond Wire Saw Blade for Silicon Wafer
Diamond wire saw blade is a flexible cutting tool in which the wire is processed into closed loops and then coated with diamonds. Mainly used for cutting hard, brittle and fibrous materials, including monocrystalline silicon, polysilicon, ceramics, tires, stones, precious metals, gemstones.
Features:
- Continuous diamond coating on wire
- Customized grain sizes
- Backing material made of alloyed special steel, stainless steel
- High cutting efficiency (speed up to 60m/s)
- High cutting precision
- Long blade-life
- Low electricity consumption
- No cooling lubricant
| Outer Diameter (mm) | Grain Size | Tensile Strength (N) | Loop Length (mm) |
| 0.42 | 200/230 | 100 | 1000-10000 |
| 0.50 | 170/200, 200/230 | 180 | 1000-10000 |
| 0.60 | 140/170, 170/200 | 260 | 1000-10000 |
| 0.65 | 140/170, 170/200 | 260 | 1000-10000 |
| 0.80 | 120/140, 140/170 | 400 | 1000-10000 |
Quick Information
Place of Origin: China
Product Name: Diamond Wire Saw Blade
Material: Alloyed special steel, stainless steel
Application: Sapphire, stone, ceramic, glass, silicon
MOQ: 100
Sample offered: Free at our cost
Shipment Method: Sea way, air way, DHL, UPS, FedEx, etc.
Port of Shipment: Shanghai, China
