Diamond Wire for Cutting Silicon Wafer
Diamond wire is a flexible cutting tool in which the wire is processed into closed loop and coated with diamond grains on the surface. The diamond wire features small diameter and strong cutting toughness, which makes precision cutting possible, and is an advanced cutting tool at present.
คุณสมบัติ
- Continuous diamond coating on wire surface
- Customized grain size
- Backing material made of alloyed special steel, stainless steel
- High cutting efficiency (speed up to 60m/s)
- High cutting precision
- Long blade-life
- Low electricity consumption
- No cooling lubricant
Parameters
| Diameter (mm) | Grain Size | Tensile Strength (N) | Loop Length (mm) |
| 0.42 | 200/230 | 80-100 | 1000-10000 |
| 0.50 | 170/200, 200/230 | 100-120 | 1000-10000 |
| 0.60 | 140/170, 170/200 | 100-120 | 1000-10000 |
| 0.65 | 140/170, 170/200 | 100-120 | 1000-10000 |
| 0.80 | 120/140, 140/170 | 180-200 | 1000-10000 |
| 1.50 | 120/140, 140/170 | 200-300 | 2500-10000 |
| 1.80 | 120/140, 140/170 | 200-300 | 2500-10000 |
General Information
Trademark
Product Name: Diamond Wire for Cutting Silicon Wafer
Material: Tungsten wire
Applications: Silicon, Quartz, Glass, Ceramic, etc.
Min Order: 100 pcs
Samples: Free at our cost
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