Diamond Wire Saw Blade for Silicon Wafer

Diamond Wire Saw for Cutting Silicon Wafer

Diamond wire saw is a flexible cutting tool in which the wire is processed into closed loop and coated with diamond grains on the surface. The wire features small diameter and strong cutting toughness, which makes precision cutting possible, and is an advanced cutting tool at present.

คุณสมบัติ

Continuous diamond coating on wire surface
Customized grain size
Backing material made of alloyed special steel, stainless steel
High cutting efficiency (speed up to 60m/s)
High cutting precision
Long blade-life
Low electricity consumption
No cooling lubricant

diamond wire saw loop — VOLDA TOOLS Leading Solution Provider in the Filed of Sawing and Cutting

VOLDA TOOLS Leading Solution Provider in the Filed of Sawing and Cutting

Parameters

Diameter (mm)	Grain Size	Tensile Strength (N)	Loop Length (mm)
0.42	200/230	80-100	1000-10000
0.50	170/200, 200/230	100-120	1000-10000
0.60	140/170, 170/200	100-120	1000-10000
0.65	140/170, 170/200	100-120	1000-10000
0.80	120/140, 140/170	180-200	1000-10000
1.50	120/140, 140/170	200-300	2500-10000
1.80	120/140, 140/170	200-300	2500-10000